Hoʻohana mākou i ka formula no-dysprosium ma nā huahana round-low-grade no nā mea kūʻai aku e hōʻemi i nā kumukūʻai.Loaʻa iā mākou kahi ʻano paʻa i hiki ke hana i nā huahana coefficient wela haʻahaʻa.Hoʻemi ia i nā kumukūʻai a hoʻonui i ka pono no nā mea kūʻai aku me ka hoʻomalu pono ʻana i ka hoʻomanawanui i ka hana ʻana a me ka uhi ʻana e like me nā koi like ʻole o nā mea kūʻai aku e hōʻoia i ka paʻa o ka pale plating i ka manawa like, me ka paʻakai paʻakai, ka uhi paʻa ikaika, colloid affinity a pēlā aku. .
Hiki i nā huahana pōʻai ke hāʻule i nā kihi i ka hana hana.No laila, loaʻa iā mākou nā lako nānā piha piha no ka hoʻomanawanui ʻana i nā hiʻohiʻona, hiki ke hōʻoia i nā hemahema o ka huahana i loko o ka palena hiki ke hoʻopaʻa ʻia a pale aku i nā huahana kīnā ʻole i ka hoʻohana ʻana i ke kaʻina hana.
Ma nā ʻōlelo o ka flux consistency, mākou e hōʻoia i ka paʻa-point sintering furnace i ke kūpaʻa o ka mana kaʻina hana magnet, a me nā mea hoʻomaʻamaʻa mākaʻikaʻi piha e pale aku i nā huahana magnetic palupalu mai ka kahe ʻana i nā mea kūʻai aku.I ka ʻōlelo o ka hoʻopili magnetization, ua ʻimi kā mākou hui i nā lako magnetization coding maʻalahi e pale aku i nā limahana mai ka hana hewa ʻana i ka uku magnetic.
I ka manaʻo o ka hoʻouna ʻana, ka nui o nā mīkini ʻoki laina nui, nā ʻāpana ʻoki, nā limahana hana ʻenehana makua, ka nānā ʻana i ke kaʻina hana huahana, kēlā me kēia pae o ka hoʻoili ʻana a me ka hana ʻana hiki ke loaʻa i ka pane holomua i kēlā me kēia manawa, laina hana huahana cylindrical makua, e hōʻoia i nā koi hoʻomalu o ka mea kūʻai aku no ka hāʻawi ʻana i ka huahana, a me ka holomua o ka hana ʻana.
NdFeB Kaʻina Hana Hana
Hoʻolauna hoʻouhi
Ili | Ka uhi ʻana | Mānoanoa μm | kalakala | Nā hola SST | Nā hola PCT | |
Nikela | Ni | 10~20 | Kahinahinahinahina | >24~72 | >24~72 | |
Ni+Cu+Ni | ||||||
Nikela ʻeleʻele | Ni+Cu+Ni | 10~20 | ʻEleʻele ʻulaʻula | >48~96 | >48 | |
Cr3+Zink | Zn C-Zn | 5~8 | ʻO Brighe Blue Kala ʻulaʻula | >16~48 >36~72 | --- | |
Sn | Ni+Cu+Ni+Sn | 10~25 | Kālā kala | >36~72 | >48 | |
Au | Ni+Cu+Ni+Au | 10~15 | gula | >12 | >48 | |
Ag | Ni+Cu+Ni+Ag | 10~ 15 | Kālā kala | >12 | >48 | |
Epoxy | Epoxy | 10~20 | ʻEleʻele/Heleele | >48 | --- | |
Ni+Cu+Epoxy | 15~30 | >72~108 | --- | |||
Zn+Epoxy | 15~25 | >72~108 | --- | |||
Ka hoʻopaʻapaʻa | --- | 1~3 | Kahinahinahina | Palekana manawa | --- | |
Phosphate | --- | 1~3 | Kahinahinahina | Palekana manawa) | --- |
Nā ʻano kino
'ikamu | Nā ʻāpana | Waiwai Kuhikuhi | Unite |
Mākēneki kōkua Waiwai | Hiki ke hoʻohuli ʻia ke ana wela o Br | -0.08--0.12 | %/℃ |
Hoʻololi ʻia ka wela wela o ka Hcj | -0.42~-0.70 | %/℃ | |
Wela Kūikawā | 0.502 | KJ·(Kg · ℃)-1 | |
Ka Mahana Curie | 310~380 | ℃ | |
Kino Mechanical Waiwai | ʻO ka mānoanoa | 7.5-7.80 | g/cm3 |
ʻO Vickers Paʻakikī | 650 | Hv | |
Kū'ē Uila | 1.4x10-6 | μQ ·m | |
Ka ikaika hoʻopili | 1050 | MPa | |
Ikaika U'i | 80 | Mpa | |
Kulou ikaika | 290 | Mpa | |
ʻO ka hoʻoili wela | 6~8.95 | W/m ·K | |
Opio Modulus | 160 | GPa | |
Hoʻonui wela(C⊥) | -1.5 | 10-6/℃-1 | |
Hoʻonui wela (CII) | 6.5 | 10-6/℃-1 |